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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10243111 B1

PDFFull Text
Date of Patent:
Mar. 26, 2019

Filed:

Jun. 23, 2017

Optoelectronic device subassemblies and methods of manufacturing the same

Applicant:

Heptagon Micro Optics Pte. Ltd., Singapore, SG;

Inventors:

Hartmut Rudmann, Jona, CH;

Qichuan Yu, Singapore, SG;

Simon Gubser, Weesen, CH;

Bojan Tesanovic, Steinhausen, CH;

Xu Yi, Singapore, SG;

Eunice Ho Hui Ong, Singapore, SG;

Hongyuan Liu, Singapore, SG;

Ji Wang, Singapore, SG;

Edmund Koon Tian Lua, Singapore, SG;

Myo Paing, Singapore, SG;

Jian Tang, Singapore, SG;

Ming Jie Lee, Singapore, SG;

Assignee:

ams Sensors Singapore Pte. Ltd., Singapore, SG;

Attorney:

Fish & Richardson P.C.

Primary Examiner:

Anthony Ho

Int. Cl.
CPC ...
H01L 33/48 (2010.01); H01L 25/16 (2006.01); H01L 31/02 (2006.01); H01L 31/0203 (2014.01); H01L 31/0232 (2014.01); H01L 33/54 (2010.01); H01L 33/58 (2010.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 33/486 (2013.01); H01L 25/167 (2013.01); H01L 31/0203 (2013.01); H01L 31/02005 (2013.01); H01L 31/02325 (2013.01); H01L 33/54 (2013.01); H01L 33/58 (2013.01); H01L 33/62 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/16195 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0058 (2013.01); H01L 2933/0066 (2013.01);
Abstract

The present disclosure describes wafer-level processes for fabricating optoelectronic device subassemblies that can be mounted, for example, to a circuit substrate, such as a flexible cable or printed circuit board, and integrated into optoelectronic modules that include one or more optical subassemblies stacked over the optoelectronic device subassembly. The optoelectronic device subassembly can be mounted onto the circuit substrate using solder reflow technology even if the optical subassemblies are composed of materials that are not reflow compatible.

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