The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 26, 2019
Filed:
Apr. 26, 2017
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
Bahman Hekmatshoartabari, White Plains, NY (US);
Ning Li, White Plains, NY (US);
Katherine L. Saenger, Ossining, NY (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/18 (2006.01); H01L 31/028 (2006.01); H01L 31/068 (2012.01); H01L 31/075 (2012.01); H01L 31/0216 (2014.01); H01L 31/0224 (2006.01); H01L 31/0352 (2006.01); H01L 31/0745 (2012.01); H01L 31/0392 (2006.01); H01L 31/0445 (2014.01); H02S 50/10 (2014.01);
U.S. Cl.
CPC ...
H01L 31/1868 (2013.01); H01L 31/028 (2013.01); H01L 31/02167 (2013.01); H01L 31/022425 (2013.01); H01L 31/022441 (2013.01); H01L 31/03529 (2013.01); H01L 31/03921 (2013.01); H01L 31/035281 (2013.01); H01L 31/0445 (2014.12); H01L 31/068 (2013.01); H01L 31/075 (2013.01); H01L 31/0745 (2013.01); H01L 31/1804 (2013.01); H01L 31/186 (2013.01); H02S 50/10 (2014.12); Y02E 10/547 (2013.01);
Abstract
After forming an absorber layer containing cracks over a back contact layer, a passivation layer is formed over a top surface of the absorber layer and interior surfaces of the cracks. The passivation layer is deposited in a manner such that that the cracks in the absorber layer are fully passivated by the passivation layer. An emitter layer is then formed over the passivation layer to pinch off upper portions of the cracks, leaving voids in lower portions of the cracks.