The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 26, 2019

Filed:

May. 22, 2015
Applicants:

Stephen Forrest, Ann Arbor, MI (US);

Jeramy D. Zimmerman, Ann Arbor, MI (US);

Xin Xu, West Windsor, NJ (US);

Christopher Kyle Renshaw, Ann Arbor, MI (US);

Inventors:

Stephen Forrest, Ann Arbor, MI (US);

Jeramy D. Zimmerman, Ann Arbor, MI (US);

Xin Xu, West Windsor, NJ (US);

Christopher Kyle Renshaw, Ann Arbor, MI (US);

Assignees:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 31/00 (2006.01); H01L 27/146 (2006.01); H01L 31/0304 (2006.01); H01L 31/0224 (2006.01); H01L 27/144 (2006.01); H01L 31/0392 (2006.01); H01L 31/075 (2012.01); H01L 31/18 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14643 (2013.01); H01L 27/1446 (2013.01); H01L 27/14618 (2013.01); H01L 27/14636 (2013.01); H01L 31/022408 (2013.01); H01L 31/0304 (2013.01); H01L 31/03926 (2013.01); H01L 31/075 (2013.01); H01L 31/1844 (2013.01); H01L 31/1892 (2013.01); Y02E 10/544 (2013.01); Y02E 10/548 (2013.01);
Abstract

A device includes a three-dimensionally curved substrate, a patterned metal layer disposed on the curved substrate, and an array of optoelectronic devices, each optoelectronic device including an optoelectronic structure supported by the curved substrate. Each optoelectronic structure includes an inorganic semiconductor stack. The device further includes a set of contact stripes extending across the curved substrate, each optoelectronic structure being coupled to a respective contact stripe of the set of contact stripes. The array of optoelectronic devices is secured to the curved substrate via a bond between the patterned metal layer and the set of contact stripes.


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