The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 26, 2019
Filed:
Jun. 28, 2017
Applicant:
Ams International Ag, Rapperswil, CH;
Inventors:
Georg Parteder, Gleisdorf, AT;
Jochen Kraft, Bruck an der Mur, AT;
Franz Schrank, Graz, AT;
Thomas Troxler, Erlenbach, CH;
Andreas Fitzi, Staefa, CH;
Assignee:
ams International AG, Rapperswil, CH;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01); H01L 25/065 (2006.01); H04N 5/225 (2006.01); H04N 5/369 (2011.01);
U.S. Cl.
CPC ...
H01L 27/14636 (2013.01); H01L 25/0657 (2013.01); H01L 27/1469 (2013.01); H01L 27/14618 (2013.01); H01L 27/14623 (2013.01); H01L 27/14634 (2013.01); H04N 5/369 (2013.01); H04N 5/2258 (2013.01);
Abstract
The sensor chip stack comprises a sensor substrate of a semiconductor material including a sensor, a chip fastened to the sensor substrate, the chip including an integrated circuit, electric interconnections between the sensor substrate and the chip, electric terminals of the chip, the chip being arranged between the electric terminals and the sensor substrate, and a molding material arranged adjacent to the chip, the electric terminals of the chip being free from the molding material.