The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 26, 2019
Filed:
Jan. 21, 2015
Osram Opto Semiconductors Gmbh, Regensburg, DE;
Lutz Hoeppel, Alteglofsheim, DE;
Juergen Moosburger, Lappersdorf, DE;
Andreas Ploessl, Regensburg, DE;
Patrick Rode, Regensburg, DE;
Peter Nagel, Regensburg, DE;
Dominik Scholz, Regensburg, DE;
OSRAM OPTO SEMICONDUCTORS GMBH, Regensburg, DE;
Abstract
A method for producing a plurality of optoelectronic semiconductor components () is provided, comprising the following steps: a) providing an auxiliary carrier (); b) providing a plurality of semiconductor chips (), wherein each of the semiconductor chips has a carrier body () and a semiconductor body () arranged on an upper side () of the carrier body; c) attaching the plurality of semiconductor chips on the auxiliary carrier, wherein the semiconductor chips are spaced apart from one another in a lateral direction (L) and wherein the semiconductor bodies are facing the auxiliary carrier, as seen from the carrier body; d) forming a scattering layer (), at least in regions between the semiconductor bodies of adjacent semiconductor chips; e) forming a composite package (); f) removing the auxiliary carrier (); and g) individually separating the composite package into a plurality of optoelectronic semiconductor components ().