The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 26, 2019
Filed:
Jan. 29, 2018
Samsung Electro-mechanics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Yong Ho Baek, Suwon-si, KR;
Joo Hwan Jung, Suwon-si, KR;
Young Sik Hur, Suwon-si, KR;
Jung Chul Gong, Suwon-si, KR;
Han Kim, Suwon-si, KR;
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, Gyeonggi-Do, KR;
Abstract
A fan-out semiconductor package module includes: a core member having a first through hole and a second through hole; a semiconductor chip disposed in the first through hole, and having an active surface and an inactive surface opposite the active surface, the active surface having a connection pad disposed thereon; at least one first passive component disposed in the second through hole; a first encapsulant encapsulating the core member encapsulating at least a portion of each of the core member and the at least one first passive component; a second encapsulant encapsulating at least a portion of the inactive surface of the semiconductor chip; and a connection member disposed on the core member, the active surface of the semiconductor chip, and the at least one first passive component, and including a redistribution layer electrically connected to the connection pad and the at least one first passive component.