The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 26, 2019

Filed:

Nov. 12, 2017
Applicant:

Xiamen Sanan Optoelectronics Technology Co., Ltd., Xiamen, CN;

Inventors:

Gaolin Zheng, Xiamen, CN;

Ling-yuan Hong, Xiamen, CN;

Xiaoxiong Lin, Xiamen, CN;

Feng Wang, Xiamen, CN;

Su-hui Lin, Xiamen, CN;

Chia-hung Chang, Xiamen, CN;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 27/00 (2006.01); H01L 33/00 (2010.01); H01L 23/60 (2006.01); H01L 27/15 (2006.01); H01L 33/38 (2010.01); H01L 33/62 (2010.01); H01L 33/64 (2010.01); H01L 33/44 (2010.01);
U.S. Cl.
CPC ...
H01L 23/60 (2013.01); H01L 27/153 (2013.01); H01L 33/0079 (2013.01); H01L 33/382 (2013.01); H01L 33/385 (2013.01); H01L 33/44 (2013.01); H01L 33/62 (2013.01); H01L 33/648 (2013.01); H01L 33/38 (2013.01); H01L 2933/0016 (2013.01);
Abstract

A fabrication method of a high-voltage light-emitting diode includes the steps of providing a substrate, and forming a light-emitting epitaxial laminated layer on the substrate; patterning the light-emitting epitaxial laminated layer and fabricating a channel that exposes the substrate surface so as to divide the light-emitting epitaxial laminated layer into a plurality of light-emitting diode units, and the light-emitting diode units at least constitute two rows; fabricating an electrode interconnection line crossing the channel, wherein, two adjacent light-emitting diode units are connected by the electrode interconnection line; fabricating an electrode bonding pad over the outmost light-emitting diode unit of the high-voltage light-emitting diode; and fabricating an insulating protective layer opening at the channel where the potential difference of any two adjacent light-emitting diodes is ≥3 times of the forward voltage of a single light-emitting diode to avoid breakdown of the light-emitting epitaxial laminated layer.


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