The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 26, 2019

Filed:

Nov. 30, 2017
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventor:

Daniel Piper, Vancouver, WA (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/544 (2006.01); H01L 21/78 (2006.01);
U.S. Cl.
CPC ...
H01L 23/544 (2013.01); H01L 21/78 (2013.01); H01L 24/11 (2013.01); H01L 24/14 (2013.01); H01L 24/94 (2013.01); H01L 2223/54406 (2013.01); H01L 2223/54433 (2013.01); H01L 2223/54453 (2013.01); H01L 2224/11462 (2013.01); H01L 2224/11618 (2013.01); H01L 2224/14163 (2013.01); H01L 2224/14517 (2013.01);
Abstract

Embodiments of the invention are directed to a method and resulting structures for forming optically readable chip identification (CID) codes using dummy controlled collapse chip connection (C4) bumps. In a non-limiting embodiment of the invention, a product chip is formed on a wafer. A chip location identifier including a plurality of controlled collapse chip connection (C4) bumps is formed on a surface of the product chip. The chip location identifier encodes a unique location of the product chip on the wafer prior to dicing. The plurality of C4 bumps are arranged into one or more optically readable alphanumeric characters.


Find Patent Forward Citations

Loading…