The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 26, 2019

Filed:

Jan. 27, 2017
Applicant:

Globalfoundries Inc., Grand Cayman, KY;

Inventors:

Irene Y. L. Lin, Los Altos Hills, CA (US);

Lei Yuan, San Jose, CA (US);

Mahbub Rashed, Cupertino, CA (US);

Assignee:

GLOBALFOUNDRIES INC., Grand Cayman, KY;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F 17/50 (2006.01); H01L 27/02 (2006.01); H01L 23/522 (2006.01); H01L 23/528 (2006.01); H01L 27/118 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5286 (2013.01); G06F 17/5077 (2013.01); H01L 23/5226 (2013.01); H01L 27/0207 (2013.01); H01L 27/11807 (2013.01); H01L 2027/11875 (2013.01); H01L 2027/11887 (2013.01);
Abstract

A multi-layer integrated circuit structure includes (among other components) a first layer having gate conductors, a second layer having M0 conductors, a third layer having M1 conductors, and a fourth layer having M2 conductors. The M0 and M2 conductors are perpendicular to the gate conductors, and parallel to each other. The M1 conductors connect the M0 conductors to the M2 conductors. The gate conductors are positioned in the first layer in the same locations in the horizontal direction. The M1 conductors are positioned in the third layer in a different location in the horizontal direction that is different from the locations of the gate conductors, so that the M1 conductors do not overlap any of the gate conductors, solving a substantial routing challenge for the input and output contacts.


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