The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 26, 2019
Filed:
May. 16, 2017
Infineon Technologies America Corp., El Segundo, CA (US);
Eung San Cho, Torrance, CA (US);
Wolfgang Furtner, Fuerstenfeldbruck, DE;
Infineon Technologies Americas Corp., El Segundo, CA (US);
Abstract
The disclosure is directed to a circuit on a substrate, such as a leadframe package, that includes shunt to measure current. The shunt is an arched conductor positioned to bridge over a die mounted on the package with voltage measurement terminals of the die electrically connected to the shunt. The techniques of this disclosure determine the shunt material, shunt size and shape to accurately control the value of the resistance of the shunt. The arrangement of the die and the shunt may include advantages of maintaining a small package size and allow accurate temperature compensation. The shunt may be long enough to have a measurable resistance that may be used to determine the current through the shunt. In some examples, the arrangement of the die and the shunt may provide additional structural support to the circuit.