The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 26, 2019

Filed:

Oct. 25, 2017
Applicants:

Katoh Electric Co., Ltd., Yamanashi, JP;

Torex Semiconductor Ltd., Tokyo, JP;

Inventors:

Shinya Sato, Yamanashi, JP;

Yuki Yasuda, Yamanashi, JP;

Yojiro Shiina, Tokyo, JP;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49568 (2013.01); H01L 21/56 (2013.01); H01L 23/49503 (2013.01); H01L 23/49517 (2013.01); H01L 23/49541 (2013.01); H01L 23/49575 (2013.01); H01L 24/49 (2013.01); H01L 24/85 (2013.01); H01L 21/568 (2013.01); H01L 23/3107 (2013.01); H01L 2224/16245 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/49171 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/92247 (2013.01); H01L 2924/15747 (2013.01);
Abstract

To increase a current that can be supplied to an electronic element mounted on an upper surface of a semiconductor package. An electronic device includes a semiconductor chip, a package that accommodates the semiconductor chip, a plurality of terminals that is electrically bonded with the semiconductor chip and is exposed on a first surface of the package, and at least one copper post that penetrates from the first surface of the package to a second surface opposite to the first surface, and that has a cross sectional area in the direction of the first surface, which is larger than the area of the plurality of terminals on the first surface.


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