The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 26, 2019

Filed:

Jan. 22, 2018
Applicant:

Globalfoundries Inc., Grand Cayman, KY;

Inventors:

Abner Bello, Clifton Park, NY (US);

Stephanie Waite, Glens Falls, NY (US);

William J. Fosnight, Saratoga Springs, NY (US);

Thomas Beeg, Gansevoort, NY (US);

Assignee:

GLOBALFOUNDRIES Inc., Grand Cayman, KY;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G01J 5/00 (2006.01); H01L 21/673 (2006.01); H01L 21/66 (2006.01); G01N 21/55 (2014.01); G01N 21/21 (2006.01); G01J 5/02 (2006.01); G01R 27/00 (2006.01); H01L 21/67 (2006.01); G01J 5/08 (2006.01); H01L 21/677 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6732 (2013.01); G01J 5/0007 (2013.01); G01J 5/025 (2013.01); G01N 21/211 (2013.01); G01N 21/55 (2013.01); G01R 27/00 (2013.01); H01L 21/67253 (2013.01); H01L 21/67353 (2013.01); H01L 21/67386 (2013.01); H01L 22/12 (2013.01); G01J 5/0825 (2013.01); G01J 5/0896 (2013.01); G01N 2201/0683 (2013.01); G01N 2201/06113 (2013.01); G01N 2201/12 (2013.01); G05B 2219/37224 (2013.01); H01L 21/67745 (2013.01);
Abstract

A self-contained metrology wafer carrier systems and methods of measuring one or more characteristics of semiconductor wafers are provided. A wafer carrier system includes, for instance, a housing configured for transport within the automated material handling system, the housing having a support configured to support a semiconductor wafer in the housing, and a metrology system disposed within the housing, the metrology system operable to measure at least one characteristic of the wafer, the metrology system comprising a sensing unit and a computing unit operably connected to the sensing unit. Also provided are methods of measuring one or more characteristics of a semiconductor wafer within the wafer carrier systems of the present disclosure.


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