The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 26, 2019

Filed:

Dec. 14, 2017
Applicant:

Toyota Jidosha Kabushiki Kaisha, Toyota-shi, Aichi-ken, JP;

Inventors:

Tetsuya Yamada, Seto, JP;

Hiroyuki Ueda, Nagakute, JP;

Tomohiko Mori, Nagakute, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/205 (2006.01); H01L 21/02 (2006.01); H01L 29/66 (2006.01); H01L 29/20 (2006.01); H01L 21/8252 (2006.01); H01L 29/78 (2006.01); H01L 29/739 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02579 (2013.01); H01L 21/02458 (2013.01); H01L 21/2056 (2013.01); H01L 21/8252 (2013.01); H01L 29/2003 (2013.01); H01L 29/6634 (2013.01); H01L 29/66522 (2013.01); H01L 29/66666 (2013.01); H01L 29/7395 (2013.01); H01L 29/7802 (2013.01);
Abstract

A method of manufacturing a switching element includes forming a recessed portion in a surface of a GaN semiconductor substrate in which a first n-type semiconductor layer is exposed on the surface, growing a p-type body layer within the recessed portion and on the surface of the GaN semiconductor substrate, removing a surface layer portion of the body layer to expose the first n-type semiconductor layer on the surface of the GaN semiconductor substrate, and leave the body layer within the recessed portion, forming a second n-type semiconductor layer which is separated from the first n-type semiconductor layer by the body layer and is exposed on the surface of the GaN semiconductor substrate, and forming a gate electrode which faces the body layer through an insulating film.


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