The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 26, 2019

Filed:

Jul. 16, 2015
Applicant:

Kabushiki Kaisha Toshiba, Minato-ku, JP;

Inventors:

Katsuhiro Sato, Yokkaichi, JP;

Hideaki Hirabayashi, Yokohama, JP;

Assignee:

Kabushiki Kaisha Toshiba, Minato-ku, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); H01L 21/02 (2006.01); B08B 3/10 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02054 (2013.01); H01L 21/02057 (2013.01); H01L 21/67057 (2013.01); H01L 21/67086 (2013.01); B08B 3/10 (2013.01);
Abstract

According to one embodiment, a processing apparatus includes a first supply section, a second supply section, a gas supply section, and a sublimation section. The first supply section supplies a first fluid on surfaces of a plurality of workpieces. The second supply section supplies a fluid containing a sublimable material on the surfaces of the plurality of workpieces to which the first fluid is supplied. The gas supply section supplies gas on the surfaces of the plurality of workpieces to which a fluid containing the sublimable material is supplied. The sublimation section sublimates a layer containing the sublimable material formed on each surface of the plurality of workpieces. The gas supply section controls a thickness of the layer containing the sublimable material formed each surface of the plurality of workpieces by controlling a flow velocity of the gas in each surface of the plurality of workpieces.


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