The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 26, 2019

Filed:

Sep. 14, 2017
Applicant:

Taiyo Yuden Co., Ltd., Chuo-ku, Tokyo, JP;

Inventors:

Kunihiko Nagaoka, Takasaki, JP;

Tomoaki Nakamura, Takasaki, JP;

Noriyuki Chigira, Takasaki, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/30 (2006.01); H01G 4/12 (2006.01); H01G 4/232 (2006.01); H01G 4/33 (2006.01); H01G 4/248 (2006.01); H01G 4/012 (2006.01);
U.S. Cl.
CPC ...
H01G 4/1227 (2013.01); H01G 4/232 (2013.01); H01G 4/33 (2013.01); H01G 4/012 (2013.01); H01G 4/248 (2013.01);
Abstract

A multilayer ceramic capacitor includes: a first and a second external electrodes; internal electrode layers that are alternately connected to the first and the second external electrodes; and dielectric layers including a ceramic material as a main component, wherein a D20% diameter of the ceramic material of an end margin region, in which internal electrode layers connected to one of the first external electrode and the second external electrode face with each other and does not face with internal electrode layers connected to the other, is smaller than that of a capacity region in which internal electrode layers connected to different external electrodes face with each other and a D80% diameter of the ceramic material of the end margin region is larger than that of the capacity region, or 1/(log D80−log D20) of the ceramic material of the capacity region is larger than that of the end margin region.


Find Patent Forward Citations

Loading…