The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 26, 2019
Filed:
Apr. 10, 2017
Applicant:
Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;
Inventor:
Yosuke Terashita, Nagaokakyo, JP;
Assignee:
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01G 4/008 (2006.01); H01G 4/12 (2006.01); H01G 4/248 (2006.01); H01G 4/30 (2006.01); H05K 1/09 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H01G 4/008 (2013.01); H01G 4/12 (2013.01); H01G 4/248 (2013.01); H01G 4/30 (2013.01); H05K 1/09 (2013.01); H05K 1/11 (2013.01); H05K 1/181 (2013.01); H05K 3/3442 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/1028 (2013.01); H05K 2201/10636 (2013.01); Y02P 70/611 (2015.11); Y02P 70/613 (2015.11);
Abstract
A multilayer-ceramic-capacitor mounting structure includes a circuit board and a multilayer ceramic capacitor. First and second external electrodes include first and second conductive resin layers on surfaces of first and second base electrode layers, respectively. The circuit board includes a copper plate on a surface of a core, disposed as a wiring pattern, and including a predetermined thickness, and signal electrodes disposed on a surface of the copper plate. The first and second external electrodes are each electrically connected to the signal electrodes of the copper plate.