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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10242243 B1

PDFFull Text
Expired
Date of Patent:
Mar. 26, 2019

Filed:

Aug. 02, 2016

Fingerprint sensor having printed circuit board and method of manufacture

Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventors:

Woon-Chun Kim, Suwon-si, KR;

Ga-Young Yoo, Suwon-si, KR;

Hyung-Mi Jung, Suwon-si, KR;

Hyun-Chul Jung, Yongin-si, KR;

Jeong-Bok Kwak, Suwon-si, KR;

Ji-Hye Shim, Suwon-si, KR;

Assignee:

Samsung Electro-Mechanics Co., Ltd., Suwon-si, KR;

Attorney:

NSIP Law

Primary Examiner:

Yubin Hung

Int. Cl.
CPC ...
G06K 9/00 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
G06K 9/0002 (2013.01); G06K 9/00053 (2013.01); H01L 21/4857 (2013.01); H01L 23/49822 (2013.01); H01L 23/49838 (2013.01); H01L 23/49894 (2013.01);
Abstract

A fingerprint sensor includes a first conductive pattern formed on one side of a core, a second conductive pattern formed on the first conductive pattern, an insulating layer formed between the first conductive pattern and the second conductive pattern, a dielectric layer configured to cover the second conductive pattern, and a protective layer covering the dielectric layer, wherein the protective layer includes a photosetting resin.

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Quick Actions:

Kim, Woon-Chun. (2019). Fingerprint sensor having printed circuit board and method of manufacture (U.S. Patent No. 10242243). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10242243

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