The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 26, 2019
Filed:
May. 14, 2018
Applicant:
Hitachi Automotive Systems, Ltd., Hitachinaka-shi, Ibaraki, JP;
Inventors:
Assignee:
Hitachi Automotive Systems, Ltd., Hitachinaka-shi, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B81B 7/00 (2006.01); G01P 5/12 (2006.01); G01F 1/684 (2006.01); B81C 1/00 (2006.01); G01F 1/692 (2006.01); H01L 21/56 (2006.01); H01L 49/02 (2006.01);
U.S. Cl.
CPC ...
G01F 1/692 (2013.01); B81B 7/0016 (2013.01); B81C 1/00825 (2013.01); G01F 1/684 (2013.01); G01F 1/6842 (2013.01); G01F 1/6845 (2013.01); G01P 5/12 (2013.01); H01L 21/565 (2013.01); H01L 28/20 (2013.01); H01L 2224/05553 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/49171 (2013.01); H01L 2924/10158 (2013.01); H01L 2924/181 (2013.01); H01L 2924/1815 (2013.01);
Abstract
A thermal airflow sensor includes a semiconductor device, a protective film a bonding wire, and a resin. The resin covers over a part of the semiconductor device so that the bonding wire is covered with the resin and the region including a thin-wall portion is exposed. The protective film is not covered with the resin and has an outer peripheral edge located outside the thin-wall portion.