The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 26, 2019

Filed:

Dec. 28, 2010
Applicants:

Ashfaqul I. Chowdhury, Broadview Heights, OH (US);

Gary R. Allen, Chesterland, OH (US);

Thomas A. Knapp, Cleveland, OH (US);

Inventors:

Ashfaqul I. Chowdhury, Broadview Heights, OH (US);

Gary R. Allen, Chesterland, OH (US);

Thomas A. Knapp, Cleveland, OH (US);

Assignee:

GE Lighting Solutions, LLC, East Cleveland, OH (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
F21K 9/64 (2016.01); F21K 9/232 (2016.01); F21V 29/63 (2015.01); F21V 29/67 (2015.01); F21V 29/70 (2015.01); F21V 29/71 (2015.01); F21V 29/74 (2015.01); F21V 29/77 (2015.01); F21V 29/83 (2015.01); F21V 29/89 (2015.01); F21V 29/507 (2015.01); F21Y 115/10 (2016.01);
U.S. Cl.
CPC ...
F21V 29/71 (2015.01); F21K 9/232 (2016.08); F21K 9/64 (2016.08); F21V 29/507 (2015.01); F21V 29/63 (2015.01); F21V 29/74 (2015.01); F21V 29/773 (2015.01); F21V 29/677 (2015.01); F21V 29/70 (2015.01); F21V 29/83 (2015.01); F21V 29/89 (2015.01); F21Y 2115/10 (2016.08); Y10T 29/4935 (2015.01);
Abstract

A heat sink comprises a heat sink body, which in some embodiments is a plastic heat sink body, and a thermally conductive layer disposed over the heat sink body. In some embodiments the thermally conductive layer comprises a copper layer. A light emitting diode (LED)-based lamp comprises the aforementioned heat sink and an LED module including one or more LED devices in which the LED module is secured with and in thermal communication with the heat sink. Some such LED-based lamps may have an A-line bulb configuration or an MR or PAR configuration. Disclosed method embodiments comprise forming a heat sink body and disposing a thermally conductive layer on the heat sink body. The forming may comprise molding the heat sink body, which may be plastic. In some method embodiments the heat sink body includes fins and the disposing includes disposing the thermally conductive layer over the fins.


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