The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 26, 2019
Filed:
Mar. 12, 2015
Applicant:
Oceanit Laboratories, Inc., Honolulu, HI (US);
Inventors:
Ganesh Kumar Arumugam, Honolulu, HI (US);
Ashavani Kumar, Honolulu, HI (US);
Vinod P. Veedu, Houston, TX (US);
Sumil Thapa, Honolulu, HI (US);
Assignee:
Oceanit Laboratories, Inc., Honolulu, HI (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C25D 17/02 (2006.01); C25D 5/22 (2006.01); C25D 17/14 (2006.01); C25D 17/00 (2006.01); B29C 39/00 (2006.01); B29L 31/00 (2006.01);
U.S. Cl.
CPC ...
C25D 5/22 (2013.01); B29C 39/003 (2013.01); C25D 17/005 (2013.01); C25D 17/14 (2013.01); B29K 2995/0005 (2013.01); B29L 2031/7722 (2013.01);
Abstract
Electroless plating is accomplished by forming a metal salt and a polymer solution as a binder into a solid electrolyte block and depositing metal on the surface by rubbing or brushing the solid electrolyte block onto a surface with minimal or no water and without an electric potential/power source. The solid electrolyte block is also conformable/moldable and can be used to deposit metal on to both conductive and nonconductive surface through electroless deposition process.