The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 26, 2019

Filed:

May. 14, 2014
Applicant:

Basf SE, Ludwigshafen, DE;

Inventors:

Marc Fricke, Osnabrueck, DE;

Dirk Weinrich, Osnabrueck, DE;

Assignee:

BASF SE, Ludwigshafen, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08J 9/00 (2006.01); C08G 18/18 (2006.01); C08J 9/28 (2006.01); C08G 18/32 (2006.01); C08G 18/22 (2006.01); C08G 101/00 (2006.01);
U.S. Cl.
CPC ...
C08J 9/286 (2013.01); C08G 18/225 (2013.01); C08G 18/3243 (2013.01); C08G 2101/0091 (2013.01); C08G 2330/00 (2013.01); C08J 2201/0502 (2013.01); C08J 2205/026 (2013.01); C08J 2205/028 (2013.01); C08J 2205/042 (2013.01); C08J 2375/02 (2013.01);
Abstract

The present invention relates to a process for producing porous materials, which comprises providing a mixture comprising a composition (A) comprising components suitable to form an organic gel and a solvent mixture (B), reacting the components in the composition (A) in the presence of the solvent mixture (B) to form a gel and drying of the gel, wherein the solvent mixture (B) is a mixture of at least two solvents and the solvent mixture has a Hansen solubility parameter δin the range of 3.0 to 5.0 MPa-, determined using the parameter δof each solvent of the solvent mixture (B). The invention further relates to the porous materials which can be obtained in this way and the use of the porous materials as thermal insulation material and in vacuum insulation panels.


Find Patent Forward Citations

Loading…