The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 26, 2019

Filed:

Nov. 09, 2016
Applicants:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Samsung Sdi Co., Ltd., Yongin-si, Gyeonggi-do, KR;

Inventors:

Hongkyoon Choi, Seoul, KR;

Chanjae Ahn, Suwon-si, KR;

Hyunjeong Jeon, Seoul, KR;

Sang Soo Jee, Hwaseong-si, KR;

Sungwon Choi, Hwaseong-si, KR;

Sung Woo Hong, Seoul, KR;

Byunghee Sohn, Yongin-si, KR;

Assignees:

SAMSUNG ELECTRONICS CO., LTD., Gyeonggi-Do, KR;

SAMSUNG SDI CO., LTD., Gyeonggi-Do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 73/14 (2006.01); B32B 27/00 (2006.01); C09D 179/08 (2006.01); C09J 179/08 (2006.01); C08G 73/10 (2006.01);
U.S. Cl.
CPC ...
C08G 73/14 (2013.01); C08G 73/1039 (2013.01); C08G 73/1042 (2013.01); C08G 73/1067 (2013.01); C09D 179/08 (2013.01); C09J 179/08 (2013.01);
Abstract

A poly(imide-amide) copolymer including a structural unit represented by Chemical Formula 1; a structural unit represented by Chemical Formula 2; and any one of a structural unit represented by Chemical Formula 3, an amic acid precursor of the structural unit represented by Chemical Formula 3, and a combination thereof; wherein a cured material of the poly(imide-amide) copolymer may have a tensile modulus of greater than or equal to about 5.5 GPa, and a yellowness index of less than or equal to about 5:


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