The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 26, 2019

Filed:

Aug. 06, 2015
Applicant:

Nova Chemicals (International) S.a., Fribourg, CH;

Inventors:

Shivendra Goyal, Calgary, CA;

Bronwyn Gillon, Calgary, CA;

Stephen Salomons, Calgary, CA;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 27/06 (2006.01); C08F 210/16 (2006.01); C08J 5/18 (2006.01); C08L 23/06 (2006.01); C08L 23/08 (2006.01); C08F 210/00 (2006.01); C08F 4/659 (2006.01);
U.S. Cl.
CPC ...
C08F 210/16 (2013.01); B32B 27/06 (2013.01); C08F 210/00 (2013.01); C08J 5/18 (2013.01); C08L 23/06 (2013.01); C08L 23/0815 (2013.01); B32B 2307/72 (2013.01); C08F 4/65908 (2013.01); C08F 4/65912 (2013.01); C08F 2420/04 (2013.01); C08F 2500/26 (2013.01); C08J 2323/08 (2013.01); C08L 2203/16 (2013.01); C08L 2205/025 (2013.01);
Abstract

Embodiments of the invention described herein relate to a polyethylene polymer composition suitable for use in the manufacture of packaging articles, flexible films and/or sheets. In one embodiment, the copolymer comprises a polyethylene resin with density 0.918 g/cmto about 0.935 g/cm, G' at G″value, as determined from Dynamic Mechanical Analysis at 190° C., of less than 40 Pa, M/Mof greater than 2, CDBIof greater than 60. Other embodiments relate to polymer compositions with defined molecular characteristics and formulations suitable for use in the manufacture of articles including films, sheets, bags and pouches with improved creep resistance and high toughness and a good balance of film stiffness and processability in monolayer and/or multi-layer film structures.


Find Patent Forward Citations

Loading…