The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 26, 2019
Filed:
Oct. 09, 2014
Applicant:
Stmicroelectronics S.r.l., Agrate Brianza, IT;
Inventors:
Luca Maggi, Garlate, IT;
Sebastiano Conti, Mistretta, IT;
Assignee:
STMicroelectronics S.r.l., Agrate Brianza, IT;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 41/313 (2013.01); B81B 7/00 (2006.01); B81C 1/00 (2006.01); H01L 23/00 (2006.01); B81C 3/00 (2006.01); H04R 19/00 (2006.01);
U.S. Cl.
CPC ...
B81B 7/0048 (2013.01); B81C 1/00238 (2013.01); B81C 1/00269 (2013.01); B81C 1/00825 (2013.01); B81C 3/001 (2013.01); H01L 24/26 (2013.01); B81B 2201/02 (2013.01); B81B 2201/0257 (2013.01); B81B 2201/0264 (2013.01); B81B 2207/012 (2013.01); B81C 2203/032 (2013.01); H04R 19/005 (2013.01);
Abstract
A microelectromechanical device includes: a substrate; a semiconductor die, bonded to the substrate and incorporating a microstructure; an adhesive film layer between the die and the substrate; and a protective layer between the die and the adhesive film layer. The protective layer has apertures, and the adhesive film layer adheres to the die through the apertures of the protective layer.