The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 26, 2019
Filed:
Apr. 12, 2013
Applicant:
Hexcel Corporation, Dublin, CA (US);
Inventor:
Bruno Boursier, Dublin, CA (US);
Assignee:
HEXCEL CORPORATION, Dublin, CA (US);
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 27/08 (2006.01); B29C 43/18 (2006.01); B32B 5/02 (2006.01); B32B 5/12 (2006.01); B32B 3/08 (2006.01); B32B 27/38 (2006.01); B29C 70/42 (2006.01); B29C 70/08 (2006.01); B29L 9/00 (2006.01); B29L 31/00 (2006.01);
U.S. Cl.
CPC ...
B32B 27/08 (2013.01); B29C 43/18 (2013.01); B29C 70/081 (2013.01); B29C 70/083 (2013.01); B29C 70/42 (2013.01); B32B 3/08 (2013.01); B32B 5/024 (2013.01); B32B 5/12 (2013.01); B32B 27/38 (2013.01); B29C 2043/181 (2013.01); B29L 2009/00 (2013.01); B29L 2031/005 (2013.01); B32B 2262/106 (2013.01); B32B 2307/738 (2013.01); B32B 2605/18 (2013.01);
Abstract
A composite assembly that can be cured to form a multi-component composite structure which does not have micro cracks along the boundaries between the various components. The composite assembly includes a structural component and a moldable component wherein the coefficients of thermal expansion of the structural component and the moldable component at the interface or boundary between the two components are such that micro cracks do not form along the interface when the composite assembly is cured to form the multi-component composite structure.