The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 26, 2019
Filed:
Sep. 17, 2015
Sodick Co., Ltd., Kanagawa, JP;
Ichiro Araie, Kanagawa, JP;
Seishi Kobayashi, Kanagawa, JP;
Yoshitaka Kato, Kanagawa, JP;
Yasuyuki Miyashita, Kanagawa, JP;
Sodick Co., Ltd., Kanagawa, JP;
Abstract
A powder sintering lamination molding method which can improve the quality of the molded product without extending the time required for the lamination molding. A powder sintering lamination molding method, including the steps of, irradiating an irradiation region of the sliced layer of a molded product surrounded by an outline profile with a laser to selectively sinter the material powder of the material powder layer within the irradiation region; wherein a cooling period is provided after the laser is irradiated along the first line and before the laser is irradiated along the second line.