The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 26, 2019

Filed:

Sep. 25, 2014
Applicant:

United Technologies Corporation, Hartford, CT (US);

Inventors:

Shawn J. Gregg, Wethersfield, CT (US);

Alexander Staroselsky, Avon, CT (US);

Gajawalli V. Srinivasan, South Windsor, CT (US);

Assignee:

United Technologies Corporation, Farmington, CT (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F01D 5/18 (2006.01); B23K 26/342 (2014.01); B23K 26/00 (2014.01); B23K 26/12 (2014.01); B23K 26/144 (2014.01); B22F 3/11 (2006.01); B22F 3/105 (2006.01); B22F 5/04 (2006.01); B23K 103/02 (2006.01); B23K 103/08 (2006.01); B23K 103/14 (2006.01); F01D 5/28 (2006.01); B33Y 10/00 (2015.01); B33Y 80/00 (2015.01);
U.S. Cl.
CPC ...
B23K 26/342 (2015.10); B22F 3/1055 (2013.01); B22F 3/11 (2013.01); B22F 5/04 (2013.01); B23K 26/0006 (2013.01); B23K 26/12 (2013.01); B23K 26/144 (2015.10); F01D 5/18 (2013.01); B22F 2207/13 (2013.01); B22F 2207/17 (2013.01); B23K 2103/02 (2018.08); B23K 2103/08 (2018.08); B23K 2103/14 (2018.08); B33Y 10/00 (2014.12); B33Y 80/00 (2014.12); F01D 5/28 (2013.01); Y02P 10/295 (2015.11);
Abstract

A method of forming a metal component having different regions containing different grain sizes and in porosities is by additive manufacturing. The method includes spreading a layer of starting powder on a temperature controlled moveable platform in a heated chamber with atmosphere and temperature control. Selected areas of the powder are melted and solidified with a computer controlled focused energy beam. The cooled platform is then indexed down and the process repeated. The grain size of the melted and solidified region can be controlled by the cooling rate during solidification which, in turn is controlled by the temperature of the chamber and the temperature of the cooled moveable platform.


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