The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 19, 2019

Filed:

Jun. 12, 2015
Applicant:

3m Innovative Properties Company, St. Paul, MN (US);

Inventors:

Muthu Sebastian, Singapore, SG;

Fong Liang Tan, Singapore, SG;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/46 (2006.01); G06F 3/041 (2006.01); H01L 31/18 (2006.01); C23C 14/00 (2006.01); H05K 3/16 (2006.01); H05K 3/38 (2006.01); G06F 3/044 (2006.01); C23C 14/08 (2006.01); C23C 14/14 (2006.01); C23C 14/34 (2006.01); C23C 18/16 (2006.01); C23C 18/38 (2006.01); C23C 18/42 (2006.01); C25D 3/38 (2006.01); C25D 3/46 (2006.01); C25D 5/48 (2006.01); C25D 5/54 (2006.01); G03F 7/20 (2006.01); G03F 7/40 (2006.01); H05K 1/02 (2006.01); H05K 1/09 (2006.01); H05K 3/06 (2006.01); C25D 7/00 (2006.01);
U.S. Cl.
CPC ...
H05K 3/467 (2013.01); C23C 14/00 (2013.01); C23C 14/083 (2013.01); C23C 14/14 (2013.01); C23C 14/34 (2013.01); C23C 18/165 (2013.01); C23C 18/1689 (2013.01); C23C 18/38 (2013.01); C23C 18/42 (2013.01); C25D 3/38 (2013.01); C25D 3/46 (2013.01); C25D 5/48 (2013.01); C25D 5/54 (2013.01); G03F 7/2002 (2013.01); G03F 7/40 (2013.01); G06F 3/041 (2013.01); G06F 3/044 (2013.01); H01L 31/1884 (2013.01); H05K 1/0274 (2013.01); H05K 1/09 (2013.01); H05K 3/064 (2013.01); H05K 3/067 (2013.01); H05K 3/16 (2013.01); H05K 3/388 (2013.01); C25D 7/00 (2013.01); G06F 2203/04103 (2013.01); H05K 3/381 (2013.01); H05K 2201/0108 (2013.01); H05K 2201/0326 (2013.01); H05K 2201/10128 (2013.01);
Abstract

The present disclosure provides a method to provide a conductive bus bar on a patterned transparent conductor, such as ITO traces used for touch screen manufacturing. The method can be a cheaper and a more convenient technique to pattern a conductive metal or metal alloy, such as copper, silver, or a copper/silver/titanium alloy, on ITO electrodes in a roll-to-roll process.


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