The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 19, 2019
Filed:
Sep. 30, 2014
Applicant:
Endress + Hauser Gmbh + Co. KG, Maulburg, DE;
Inventors:
Christoph Hippin, Grenzach-Wyhlen, DE;
Jenny Schone, Zell-Gresgen, DE;
Assignee:
ENDRESS+HAUSER SE+CO.KG, Maulburg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23P 19/00 (2006.01); H05K 3/34 (2006.01); H05K 3/22 (2006.01); B23K 1/00 (2006.01); B23K 3/06 (2006.01); H05K 13/00 (2006.01); H05K 3/12 (2006.01);
U.S. Cl.
CPC ...
H05K 3/341 (2013.01); B23K 1/0016 (2013.01); B23K 3/0638 (2013.01); H05K 3/225 (2013.01); H05K 3/3484 (2013.01); H05K 13/0015 (2013.01); H05K 13/0069 (2013.01); H05K 3/1275 (2013.01); H05K 3/3431 (2013.01); H05K 2203/0195 (2013.01); H05K 2203/0338 (2013.01); H05K 2203/176 (2013.01); Y10T 29/53174 (2015.01);
Abstract
A solder application stamp embodied to transfer solder paste from a reservoir to a contact location of a circuit board. The solder stamp has a basic body having an end area and a protrusion, which protrudes out of the end area. The solder application to create solder paste dots of diameters as small as 10-300 μm.