The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 19, 2019
Filed:
Apr. 03, 2018
Applicant:
Canon Kabushiki Kaisha, Tokyo, JP;
Inventor:
Takashi Tokoro, Sagamihara, JP;
Assignee:
Canon Kabushiki Kaisha, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/02 (2006.01); H05K 3/42 (2006.01); H01R 13/6471 (2011.01); H05K 3/46 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0298 (2013.01); H01R 13/6471 (2013.01); H05K 1/115 (2013.01); H05K 3/429 (2013.01); H05K 3/4626 (2013.01); H05K 3/3447 (2013.01); H05K 2201/09536 (2013.01); H05K 2201/09627 (2013.01);
Abstract
Signal transmission characteristics in a case where a conductive pin is inserted into a through hole to perform connection with an external circuit are improved. A multilayer wiring substrate includes a front layer and a rear layer, and includes a plurality of layers in an inner layer. A conductive portion is provided in each of the layers, and a wiring is disposed on the rear layer. The conductive pin for connection with the external circuit is inserted into the through hole. A land is disposed around the through hole on the rear layer, and the land and the conductive pin are connected to each other through solder.