The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 19, 2019
Filed:
Sep. 30, 2014
Applicant:
Fujikura Ltd., Tokyo, JP;
Inventors:
Assignee:
FUJIKURA LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 3/00 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
H05K 1/028 (2013.01); H05K 1/0215 (2013.01); H05K 1/0281 (2013.01); H05K 1/0298 (2013.01); H05K 1/115 (2013.01); H05K 3/0061 (2013.01); H05K 1/0393 (2013.01); H05K 1/118 (2013.01); H05K 2201/0305 (2013.01); H05K 2201/09063 (2013.01); H05K 2201/09554 (2013.01); H05K 2201/09627 (2013.01); H05K 2203/043 (2013.01); H05K 2203/1178 (2013.01); H05K 2203/167 (2013.01);
Abstract
A wiring board assembly () includes: a flexible printed wiring board () which includes at least an insulating substrate () including a through-hole (), and wiring patterns () and () provided on the insulating substrate () and extending to peripheral edge portions () and () of the through-hole (); a metal reinforcing plate () attached to the flexible printed wiring board () and facing the through-hole (); and a solder connection portion () covering an inner wall surface () of the through-hole () and electrically connecting the wiring patterns () and () to the metal reinforcing plate ().