The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 19, 2019
Filed:
Sep. 07, 2015
International Business Machines Corporation, Armonk, NY (US);
Phillip D. Isaacs, Rochester, MN (US);
Michael T. Peets, Staatsburg, NY (US);
Xiaojin Wei, Poughkeepsie, NY (US);
INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US);
Abstract
Manufacturing electronic packages is provided with enhanced heat dissipation capabilities. The method includes providing a plurality of electronic components, and an enclosure in which the electronic components reside. The enclosure includes a thermally conductive cover overlying the electronic components. The method includes providing at least one heat transfer element coupled to, or integrated with, the thermally conductive cover between a main surface of the cover and at least one respective electronic component. Further, the method includes providing a thermal interface material disposed between the heat transfer element(s) and the respective electronic component(s), which facilitates conductive transfer of heat from the electronic component(s) to the thermally conductive cover through the heat transfer element(s). The thermally conductive cover facilitates spreading and dissipating of the transferred heat outwards, for instance, through a surrounding tamper-respondent sensor and/or a surrounding encapsulant.