The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 19, 2019

Filed:

Nov. 20, 2014
Applicant:

Toyota Jidosha Kabushiki Kaisha, Toyota-shi, Aichi-ken, JP;

Inventors:

Daisuke Mizushima, Toyota, JP;

Toshiaki Masui, Okazaki, JP;

Hironari Adachi, Toyota, JP;

Hirofumi Inoshita, Nagoya, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02K 15/04 (2006.01); H01B 13/02 (2006.01); D07B 7/02 (2006.01); H01B 13/08 (2006.01); H01B 13/00 (2006.01); D07B 1/14 (2006.01); D07B 5/12 (2006.01);
U.S. Cl.
CPC ...
H02K 15/0435 (2013.01); D07B 7/027 (2013.01); H01B 13/0285 (2013.01); H01B 13/0883 (2013.01); H02K 15/04 (2013.01); D07B 1/147 (2013.01); D07B 5/12 (2013.01); D07B 2201/2004 (2013.01); D07B 2401/2015 (2013.01); H01B 13/0006 (2013.01);
Abstract

A method of manufacturing an assembled conductor includes: arranging a plurality of peripheral wires having anisotropic cross-sectional shapes around a central wire; bundling the central wire and the peripheral wires that have been arranged, to form a conducting wire bundle; and rolling the conducting wire bundle to form the assembled conductor. The arranging includes a bending process for bending the plurality of peripheral wires in directions along imaginary lines that extend radially relative to an axis of the central wire on an imaginary plane intersecting the axis of the central wire.


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