The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 19, 2019

Filed:

Nov. 11, 2015
Applicant:

Telefonaktiebolaget Lm Ericsson (Publ), Stockholm, SE;

Inventors:

Mehrdad Mir Shafiei, Montreal, CA;

Robert Brunner, Montreal, CA;

Stephane Lessard, Mirabel, CA;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01S 5/00 (2006.01); H01S 5/10 (2006.01); H01S 5/026 (2006.01); H01S 5/14 (2006.01); H01S 5/125 (2006.01); H01S 5/02 (2006.01); H01S 5/323 (2006.01); H01S 5/30 (2006.01);
U.S. Cl.
CPC ...
H01S 5/105 (2013.01); H01S 5/0071 (2013.01); H01S 5/0078 (2013.01); H01S 5/021 (2013.01); H01S 5/026 (2013.01); H01S 5/0268 (2013.01); H01S 5/1003 (2013.01); H01S 5/1032 (2013.01); H01S 5/125 (2013.01); H01S 5/141 (2013.01); H01S 5/3013 (2013.01); H01S 5/323 (2013.01); H01S 5/3235 (2013.01); H01S 5/32341 (2013.01);
Abstract

The teachings herein disclose a laser assembly () that implements a 'composite cavity' formed in part in a III/V die (), in part in a silicon die (), and in part in a glass member () having a waveguide () coupling the cavity portion in the III/V die with the cavity portion in the silicon die. This arrangement capitalizes on the lasing efficiency of the III/V die, which is used as the gain medium while advantageously using the glass member to extend the lasing cavity into the silicon die. Laser-scribing the cavity waveguide in place after mounting the III/V die, the silicon die or dies, and the glass member, greatly relaxes the mounting alignment precision needed for the constituent parts of the overall assembly. Moreover, in one or more embodiments, glass member includes one or more laser-scribed waveguides operative as optical interconnects going between two or more silicon dies.


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