The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 19, 2019

Filed:

Jun. 08, 2016
Applicant:

Mitsubishi Heavy Industries, Ltd., Tokyo, JP;

Inventors:

Yoshiyuki Kondo, Tokyo, JP;

Yuichi Otani, Tokyo, JP;

Yoshiteru Komuro, Tokyo, JP;

Atsushi Kodama, Tokyo, JP;

Koichi Hamamoto, Tokyo, JP;

Hiroyuki Daigo, Tokyo, JP;

Naoki Inoue, Tokyo, JP;

Tomoya Morioka, Tokyo, JP;

Masahiro Kato, Tokyo, JP;

Shingo Nishikata, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 3/042 (2006.01); H01S 3/063 (2006.01); H01S 3/10 (2006.01); H01S 3/06 (2006.01); H01S 3/16 (2006.01); H01S 3/23 (2006.01); H01S 3/00 (2006.01); H01S 3/02 (2006.01); H01S 3/04 (2006.01);
U.S. Cl.
CPC ...
H01S 3/042 (2013.01); H01S 3/0407 (2013.01); H01S 3/063 (2013.01); H01S 3/0612 (2013.01); H01S 3/10007 (2013.01); H01S 3/005 (2013.01); H01S 3/025 (2013.01); H01S 3/0405 (2013.01); H01S 3/0604 (2013.01); H01S 3/0621 (2013.01); H01S 3/1611 (2013.01); H01S 3/1643 (2013.01); H01S 3/1685 (2013.01); H01S 3/2316 (2013.01);
Abstract

A solid laser amplification device having a laser medium that has a solid medium, into which a laser light enters and from which the laser light is emitted, and an amplification layer, provided on the surface of the medium, receives the laser light in the medium, and amplifies and reflects the light toward the exit; and a microchannel cooling part that has a plurality of cooling pipelines, into which a cooling solvent is conducted and which are arranged parallel to the surface of the amplification layer, and a cooling surface, at the outer periphery of the cooling pipelines and attached on the surface of the amplification layer, the microchannel cooling part cooling the amplification layer. The closer the position of the cooling pipeline to a position facing a section of the amplification layer that receives the laser light, the greater the cooling force exhibited by the cooling part.


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