The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 19, 2019

Filed:

Nov. 09, 2015
Applicant:

Hansol Technics Inc., Seoul, KR;

Inventors:

Jae-Ho Boo, Seoul, KR;

Chi-Young Choi, Uiwang-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01); H01Q 1/38 (2006.01); H01Q 1/24 (2006.01); H05K 3/06 (2006.01); H05K 3/22 (2006.01); H05K 3/40 (2006.01); H05K 1/11 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/38 (2013.01); H01Q 1/243 (2013.01); H05K 1/032 (2013.01); H05K 1/119 (2013.01); H05K 3/0014 (2013.01); H05K 3/06 (2013.01); H05K 3/22 (2013.01); H05K 3/4038 (2013.01); H05K 2201/0145 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/0355 (2013.01); H05K 2201/09018 (2013.01); H05K 2203/0759 (2013.01);
Abstract

The curved-type rigid board includes: a main sheet layer capable of maintaining a curved state with a certain curvature; a first adhesive layer formed on the main sheet layer; a sub sheet layer bonded onto the main sheet layer by the first adhesive layer while the sub sheet layer forms a line structure having diagonal lines, which do not match directions of horizontal and vertical lines of the mesh structure of the thermosetting resin of which the main sheet layer is made, in order for the main sheet layer to have rigidity to maintain the curved state; a second adhesive layer formed on the sub sheet layer; and a pattern forming layer bonded onto the sub sheet layer by the second adhesive layer.


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