The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 19, 2019
Filed:
Feb. 17, 2014
Applicant:
Dai Nippon Printing Co., Ltd., Tokyo, JP;
Inventors:
Tetsuya Ojiri, Tokyo, JP;
Tsuyoshi Suzuki, Tokyo, JP;
Kazuhiko Yokota, Tokyo, JP;
Rikiya Yamashita, Tokyo, JP;
Masakazu Kandori, Tokyo, JP;
Assignee:
DAI NIPPON PRINTING CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01M 2/02 (2006.01); B32B 7/02 (2019.01); B32B 15/20 (2006.01); B32B 27/08 (2006.01); B32B 27/32 (2006.01); B32B 15/085 (2006.01); B32B 37/06 (2006.01); B32B 37/18 (2006.01); B32B 27/28 (2006.01); B32B 27/30 (2006.01); B32B 15/08 (2006.01);
U.S. Cl.
CPC ...
H01M 2/029 (2013.01); B32B 7/02 (2013.01); B32B 15/08 (2013.01); B32B 15/085 (2013.01); B32B 15/20 (2013.01); B32B 27/08 (2013.01); B32B 27/28 (2013.01); B32B 27/308 (2013.01); B32B 27/32 (2013.01); B32B 37/06 (2013.01); B32B 37/182 (2013.01); H01M 2/0275 (2013.01); H01M 2/0277 (2013.01); H01M 2/0285 (2013.01); H01M 2/0287 (2013.01); B32B 2307/51 (2013.01); B32B 2307/536 (2013.01); B32B 2307/7265 (2013.01); B32B 2311/24 (2013.01); B32B 2323/04 (2013.01); B32B 2323/10 (2013.01); B32B 2439/00 (2013.01); B32B 2457/10 (2013.01); B32B 2553/00 (2013.01); H01M 2002/0297 (2013.01);
Abstract
A power-cell packaging material including a layered body obtained by layering at least a substrate layer, a metal layer, an insulating layer, and a sealant layer, in this order. The insulating layer has a hardness in the range of 10-300 MPa, when measured by using a nanoindenter and pressing the indenter 5 μm into the insulating layer from a cross-section of the layered body in the layering direction thereof.