IDiyas

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10236446 B1

PDFFull Text
Date of Patent:
Mar. 19, 2019

Filed:

Jun. 08, 2016

Manufacturing apparatus for flexible electronics

Applicant:

Royole Corporation, Fremont, CA (US);

Inventors:

Xiaojun Yu, Fremont, CA (US);

Ze Yuan, Fremont, CA (US);

Peng Wei, Fremont, CA (US);

Zihong Liu, Fremont, CA (US);

Assignee:

SHENZHEN ROYOLE TECHNOLOGIES CO. LTD., Shenzhen, Guangdong, CN;

Attorney:

Morgan, Lewis & Bockius LLP

Primary Examiner:

Mark A Osele

Int. Cl.
CPC ...
B32B 43/00 (2006.01); H01L 51/00 (2006.01); H01L 27/12 (2006.01); H01L 51/56 (2006.01); H01L 27/32 (2006.01);
U.S. Cl.
CPC ...
H01L 51/003 (2013.01); H01L 27/12 (2013.01); H01L 51/00 (2013.01); H01L 51/0097 (2013.01); H01L 51/56 (2013.01); H01L 27/3244 (2013.01); H01L 2227/326 (2013.01); H01L 2251/5338 (2013.01); Y02E 10/549 (2013.01); Y02P 70/521 (2015.11); Y10S 156/93 (2013.01); Y10S 156/941 (2013.01); Y10T 156/1132 (2015.01); Y10T 156/1168 (2015.01); Y10T 156/1944 (2015.01); Y10T 156/1978 (2015.01);
Abstract

This application discloses a method of forming a flexible substrate using a detachment apparatus. The flexible substrate includes a debonding region, and one or more edge regions located in proximity to one or more edges of the flexible substrate. The detachment apparatus detaches the one or more edge regions of the flexible substrate from a rigid carrier that is configured to support the flexible substrate device, and detach the debonding region of the flexible substrate from the rigid carrier to which a bottom surface of the debonding region is configured to adhere. Specifically, the detachment apparatus detaches the debonding region by contacting the top surface of the flexible substrate at a plurality of suction locations located on the debonding region of the flexible substrate, and applying detachment force at the plurality of suction locations to peel the flexible substrate off the rigid carrier.

Find Patent Forward Citations

Loading…