The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 19, 2019
Filed:
May. 13, 2014
Applicant:
Seoul Semiconductor Co., Ltd, Ansan-si, KR;
Inventors:
Assignee:
SEOUL SEMICONDUCTOR CO., LTD., Ansan-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 33/50 (2010.01); H01L 33/48 (2010.01); H01L 33/60 (2010.01); H01L 27/15 (2006.01); H01L 33/58 (2010.01); H01L 25/075 (2006.01); H01L 33/14 (2010.01); H01L 33/20 (2010.01); H01L 33/36 (2010.01);
U.S. Cl.
CPC ...
H01L 33/502 (2013.01); H01L 27/156 (2013.01); H01L 33/0095 (2013.01); H01L 33/486 (2013.01); H01L 33/50 (2013.01); H01L 33/58 (2013.01); H01L 33/60 (2013.01); H01L 25/0753 (2013.01); H01L 33/14 (2013.01); H01L 33/20 (2013.01); H01L 33/36 (2013.01); H01L 2924/0002 (2013.01); H01L 2933/0016 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0041 (2013.01); H01L 2933/0058 (2013.01);
Abstract
Disclosed are a light-emitting device package, a manufacturing method therefor, and a vehicle lamp and a backlight unit including the same. The light-emitting device package includes: a light-emitting chip having electrode pads positioned at a lower part thereof; a wavelength conversion unit for covering at least an upper surface and lateral surfaces of the light-emitting chip; and a reflective part which covers the lateral surfaces of the light-emitting chip. Accordingly, the light-emitting device package can be miniaturized and a separate substrate for forming a lens is not required.