The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 19, 2019

Filed:

Oct. 03, 2016
Applicant:

Luminus, Inc., Sunnyvale, CA (US);

Inventors:

Qifeng Shan, Santa Clara, CA (US);

Tao Tong, Fremont, CA (US);

Daniel Than, Sunnyvale, CA (US);

Assignee:

Luminus, Inc., Sunnyvale, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/50 (2010.01); H01L 33/48 (2010.01); H05B 33/08 (2006.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 33/50 (2013.01); H01L 33/486 (2013.01); H01L 33/62 (2013.01); H05B 33/086 (2013.01);
Abstract

An LED assembly includes two strings of surface mounted LED devices mounted to a central ceramic plug portion of a PCB substrate. One string has a CCT of 4000 degrees Kelvin. The other has a CCT of 1800 degrees Kelvin. For each LED device in one string there is a corresponding LED device in the other string. The LED devices of each pair are closely spaced with 0.2-0.6 mm between them. A Highly Reflective (HR) layer is disposed on the substrate between the LED devices. The HR layer has a thickness in a range of from 20 to 50 percent H, where H is the height of an LED die. A transparent silicone layer covers the LED devices. A resistor of a warm-dimming circuit is mounted over the ceramic portion of the substrate whereas an integrated circuit portion of the circuit is mounted over the PCB portion of the substrate.


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