The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 19, 2019
Filed:
Feb. 02, 2016
Applicant:
Sony Corporation, Tokyo, JP;
Inventor:
Yusuke Mada, Tokyo, JP;
Assignee:
SONY CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01); H01L 23/00 (2006.01); H01L 27/14 (2006.01); H04N 5/225 (2006.01); G02B 7/02 (2006.01); H04N 5/369 (2011.01);
U.S. Cl.
CPC ...
H01L 27/14618 (2013.01); G02B 7/02 (2013.01); H01L 24/73 (2013.01); H01L 24/83 (2013.01); H01L 24/92 (2013.01); H01L 27/14 (2013.01); H04N 5/2251 (2013.01); H04N 5/2253 (2013.01); H04N 5/2257 (2013.01); H04N 5/369 (2013.01); H01L 24/16 (2013.01); H01L 24/48 (2013.01); H01L 24/81 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/83139 (2013.01); H01L 2224/83194 (2013.01); H01L 2224/83203 (2013.01); H01L 2224/83851 (2013.01); H01L 2224/92225 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/15151 (2013.01); H01L 2924/16151 (2013.01); H01L 2924/16152 (2013.01);
Abstract
The present technology relates to a camera module and an electronic apparatus that can lower the risk of breakage. An imaging element has a light receiving surface to receive light, and is flip-chip mounted on a base. A joining material is joined to the optical back surface of the imaging element so that a space is formed between the joining material and a back-surface-side member provided on the side of the optical back surface on the opposite side of the imaging element from the light receiving surface. The present technology can be applied to camera modules and the like that capture images, for example.