The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 19, 2019

Filed:

Nov. 30, 2017
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Yong Min Kwon, Seoul, KR;

Kyoung Jun Kim, Yongin-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01); H01L 25/075 (2006.01); H01L 25/16 (2006.01); H01L 33/06 (2010.01); H01L 33/30 (2010.01); H01L 33/32 (2010.01); H01L 33/62 (2010.01); H01L 27/02 (2006.01); H01L 33/58 (2010.01); H01C 7/12 (2006.01); H01L 49/02 (2006.01); H01L 29/866 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0753 (2013.01); H01L 25/167 (2013.01); H01L 27/0248 (2013.01); H01L 33/06 (2013.01); H01L 33/30 (2013.01); H01L 33/32 (2013.01); H01L 33/58 (2013.01); H01L 33/62 (2013.01); H01C 7/12 (2013.01); H01L 28/26 (2013.01); H01L 29/866 (2013.01);
Abstract

A light emitting device package is provided. The light emitting device package includes three light emitting diode (LED) chips configured to emit light having different wavelengths, each of the three LED chips including a light emitting structure having a first conductivity-type semiconductor layer, a second conductivity-type semiconductor layer, and an active layer interposed between the first conductivity-type semiconductor layer and the second conductivity-type semiconductor layer; a through electrode portion disposed adjacent to the three LED chips; a molding portion encapsulating respective side surfaces of the three LED chips and the through electrode portion; a transparent electrode layer disposed on a first surface of the molding portion, the three LED chips, and the through electrode portion; and three individual electrodes exposed through a second surface of the molding portion and disposed on the three LED chips, respectively.


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