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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10236271 B1

PDFFull Text
Date of Patent:
Mar. 19, 2019

Filed:

Jul. 10, 2014

Semiconductor device and electronic device having the same

Applicant:

Semiconductor Energy Laboratory Co., Ltd., Atsugi-shi, Kanagawa-ken, JP;

Inventors:

Yukie Suzuki, Isehara, JP;

Yasuyuki Arai, Atsugi, JP;

Shunpei Yamazaki, Setagaya, JP;

Assignee:

Semiconductor Energy Laboratory Co., Ltd., Kanagawa-ken, JP;

Attorneys:

Robinson Intellectual Property Law Office

Eric J. Robinson

Primary Examiner:

Michael G Lee

Assistant Examiner:

David Tardif

Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/84 (2006.01); H01L 27/105 (2006.01); H01L 27/12 (2006.01); H01Q 23/00 (2006.01); H01L 23/64 (2006.01); H01L 23/66 (2006.01); H01L 25/065 (2006.01); H01L 25/16 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 24/32 (2013.01); H01L 21/84 (2013.01); H01L 23/64 (2013.01); H01L 23/66 (2013.01); H01L 25/0657 (2013.01); H01L 25/16 (2013.01); H01L 27/105 (2013.01); H01L 27/1052 (2013.01); H01L 27/1214 (2013.01); H01L 27/1266 (2013.01); H01Q 23/00 (2013.01); H01L 21/6836 (2013.01); H01L 24/29 (2013.01); H01L 24/83 (2013.01); H01L 24/97 (2013.01); H01L 2221/6835 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68377 (2013.01); H01L 2221/68381 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/03002 (2013.01); H01L 2224/03009 (2013.01); H01L 2224/06181 (2013.01); H01L 2224/2912 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/2939 (2013.01); H01L 2224/29109 (2013.01); H01L 2224/29111 (2013.01); H01L 2224/29113 (2013.01); H01L 2224/29118 (2013.01); H01L 2224/29139 (2013.01); H01L 2224/29147 (2013.01); H01L 2224/29155 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/29344 (2013.01); H01L 2224/29347 (2013.01); H01L 2224/29364 (2013.01); H01L 2224/29439 (2013.01); H01L 2224/29444 (2013.01); H01L 2224/29447 (2013.01); H01L 2224/29464 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32265 (2013.01); H01L 2224/32501 (2013.01); H01L 2224/33181 (2013.01); H01L 2224/83005 (2013.01); H01L 2224/83007 (2013.01); H01L 2224/83851 (2013.01); H01L 2224/94 (2013.01); H01L 2224/97 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06565 (2013.01); H01L 2924/07811 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/12044 (2013.01); H01L 2924/14 (2013.01); H01L 2924/142 (2013.01); H01L 2924/15788 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/19104 (2013.01);
Abstract

It is an object of the present invention to provide a wireless chip of which mechanical strength can be increased. Moreover, it is an object of the present invention to provide a wireless chip which can prevent an electric wave from being blocked. The invention is a wireless chip in which a layer having a thin film transistor is fixed to an antenna by an anisotropic conductive adhesive or a conductive layer, and the thin film transistor is connected to the antenna. The antenna has a dielectric layer, a first conductive layer, and a second conductive layer. The dielectric layer is sandwiched between the first conductive layer and the second conductive layer. The first conductive layer serves as a radiating electrode and the second conductive layer serves as a ground contact body.

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