The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 19, 2019

Filed:

Nov. 03, 2015
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventors:

Takashi Miyake, Tokyo, JP;

Masamichi Masuda, Tachikawa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/13 (2006.01); H05K 1/14 (2006.01); H05K 3/38 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 21/56 (2006.01); H05K 3/00 (2006.01); H05K 3/28 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49838 (2013.01); H01L 21/565 (2013.01); H01L 23/49805 (2013.01); H01L 23/49822 (2013.01); H01L 23/13 (2013.01); H01L 23/3121 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/97 (2013.01); H01L 2924/181 (2013.01); H05K 1/141 (2013.01); H05K 3/0052 (2013.01); H05K 3/284 (2013.01); H05K 2201/049 (2013.01); H05K 2201/10378 (2013.01);
Abstract

An electronic component includes an electronic device, a mounting member for mounting the electronic device and having a first connecting portion electrically coupled to the electronic device and a second connecting portion, and a sealing member covering the electronic device and the first connecting portion. The mounting member includes a substrate having a mounting surface mounting the electronic device, a first conductive layer disposed on the mounting surface, and a second conductive layer. The first conductive layer includes a first conductive pattern having the first connecting portion and a second conductive pattern having the second connecting portion and spaced apart from the first conductive pattern in a second direction along the mounting surface. The second conductive pattern is connected to the first conductive pattern through a third conductive pattern included in the second conductive layer. The sealing member does not cover the second conductive pattern.


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