The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 19, 2019

Filed:

Jan. 29, 2018
Applicant:

Kyocera Corporation, Kyoto-shi, Kyoto, JP;

Inventor:

Akihiko Funahashi, Kagoshima, JP;

Assignee:

KYOCERA CORPORATION, Kyoto-Shi, Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/13 (2006.01); H01L 33/48 (2010.01); H01L 33/62 (2010.01); H01L 23/053 (2006.01); H01L 23/373 (2006.01); H01L 23/498 (2006.01); H01L 23/544 (2006.01); H01L 27/146 (2006.01);
U.S. Cl.
CPC ...
H01L 23/053 (2013.01); H01L 21/4857 (2013.01); H01L 23/13 (2013.01); H01L 23/49811 (2013.01); H01L 27/14618 (2013.01); H01L 27/14636 (2013.01); H01L 33/486 (2013.01); H01L 33/62 (2013.01); H01L 23/3735 (2013.01); H01L 23/49822 (2013.01); H01L 23/49838 (2013.01); H01L 23/544 (2013.01); H01L 24/16 (2013.01); H01L 24/48 (2013.01); H01L 2223/54426 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/14 (2013.01);
Abstract

An electronic component mounting board reduces shadows produced along its perimeter to improve the mountability of an electronic device and an electronic module. An electronic component mounting board () includes a substrate () including a mount area () in which an electronic component () is mountable. The substrate () includes electrode pads located at ends of the mount area () as viewed from above. The electronic component mounting board () includes a frame () located outside the electrode pads () on the upper surface of the substrate (). The frame () includes at least one side surface that slopes from an upper end to a lower end of the frame (), and flares from the upper end to the lower end as viewed from above.


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