The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 19, 2019

Filed:

May. 12, 2016
Applicant:

Commissariat a L'energie Atomique ET Aux Energies Alternatives, Paris, FR;

Inventors:

Aurélie Tauzin, St Egreve, FR;

Bruno Imbert, Grenoble, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/78 (2006.01); H01L 21/324 (2006.01); H01L 21/762 (2006.01); H01L 23/00 (2006.01); H01L 21/306 (2006.01); H01L 31/0725 (2012.01); H01L 31/0735 (2012.01);
U.S. Cl.
CPC ...
H01L 21/7806 (2013.01); H01L 21/3245 (2013.01); H01L 21/76254 (2013.01); H01L 24/80 (2013.01); H01L 21/30612 (2013.01); H01L 31/0725 (2013.01); H01L 31/0735 (2013.01); H01L 2224/80004 (2013.01); H01L 2224/8009 (2013.01); H01L 2224/80011 (2013.01); H01L 2224/80055 (2013.01); H01L 2224/80075 (2013.01); H01L 2224/80894 (2013.01); H01L 2224/80948 (2013.01); H01L 2924/10329 (2013.01); H01L 2924/10335 (2013.01);
Abstract

The method is carried out of a first substrate having a first layer made of a first material with a second substrate having a second layer made of a second material, the first material and the second material being of different natures and selected from alloys of elements of columns III and V, the method having the steps of: a) providing the first substrate and the second substrate, b) bringing the first substrate into contact with the second substrate so as to form a bonding interface between the first layer and the second layer, c) performing a first heat treatment at a first predefined temperature, d) thinning one of the substrates, e) depositing, at a temperature less than or equal to the first predefined temperature, a barrier layer, on the thinned substrate, and f) performing a second heat treatment at a second predefined temperature, greater than the first predefined temperature.


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