The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 19, 2019

Filed:

Nov. 29, 2017
Applicant:

Yazaki Corporation, Tokyo, JP;

Inventors:

Hiroyuki Yoshida, Shizuoka, JP;

Hideomi Adachi, Shizuoka, JP;

Takeshi Ogue, Shizuoka, JP;

Masahide Tsuru, Shizuoka, JP;

Kenta Yanazawa, Shizuoka, JP;

Toshihiro Nagashima, Shizuoka, JP;

Assignee:

YAZAKI CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01B 7/00 (2006.01); H01B 7/02 (2006.01); H01B 13/14 (2006.01); H01B 13/012 (2006.01); H02G 3/04 (2006.01);
U.S. Cl.
CPC ...
H01B 7/0045 (2013.01); H01B 7/0275 (2013.01); H01B 13/01209 (2013.01); H01B 13/01263 (2013.01); H01B 13/14 (2013.01); H02G 3/0468 (2013.01);
Abstract

A wire harness including one or more electrically conductive paths and a resin molded product having a tubular shape which accommodates and protects the one or more electrically conductive paths. The resin molded product includes a first part having clearances along a circumferential direction between an inner surface of the resin molded product and outer surfaces of the one or more electrically conductive paths and a second part having substantially no clearance between the inner surface of the resin molded product and an outer surface of one of the one or more electrically conductive paths in an area along the circumferential directions.


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