The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 19, 2019

Filed:

May. 03, 2016
Applicant:

Zhejiang University, Hangzhou, Zhejiang, CN;

Inventors:

Lingyun Ye, Zhejiang, CN;

Xinglin Sun, Zhejiang, CN;

Caixia Li, Zhejiang, CN;

Kaichen Song, Zhejiang, CN;

Assignee:

ZHEJIANG UNIVERSITY, Hangzhou, Zhejiang, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 13/40 (2006.01);
U.S. Cl.
CPC ...
G06F 13/4027 (2013.01); G06F 13/40 (2013.01); G06F 13/4095 (2013.01);
Abstract

A stacking modular instrument bus device includes N instrument sub-modules, N+1 customized bus connectors, a first bus termination module and a second bus termination module. The N instrument sub-modules are connected with each other in series through the N−1 customized bus connectors to form an instrument sub-system, two ends of the N instrument sub-modules are respectively connected with the first bus termination module and the second bus termination module through one customized bus connector; each of the instrument sub-modules includes a bus unit and a functional unit. The present invention can freely stack and combine all the instrument sub-modules in the manner of building blocks, which is divorced from the conventional backboard type structure and becomes more flexible. Every instrument sub-module has the independent and complete instrument structure and form the system itself. The bus unit of the instrument sub-module is detached from the functional unit thereof.


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