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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10234969 B1

PDFFull Text
Date of Patent:
Mar. 19, 2019

Filed:

Apr. 24, 2017

Method of forming a composite conductive film

Applicant:

Sinovia Technologies, Foster City, CA (US);

Inventors:

Whitney Gaynor, Menlo Park, CA (US);

George Burkhard, Redwood City, CA (US);

Assignee:

Sinovia Technologies, Foster City, CA (US);

Attorney:

Morgan, Lewis & Bockius LLP

Primary Examiner:

Dah-Wei D Yuan

Assistant Examiner:

Jose Hernandez-Diaz

Int. Cl.
CPC ...
H01B 13/00 (2006.01); G03F 7/16 (2006.01); G03F 7/004 (2006.01); H05K 3/10 (2006.01); G06F 3/041 (2006.01); H05K 1/02 (2006.01); H05K 1/09 (2006.01); H05K 1/03 (2006.01); B82Y 10/00 (2011.01); B82Y 40/00 (2011.01); G03F 7/00 (2006.01); H01B 1/22 (2006.01); G06F 3/044 (2006.01); B05D 3/00 (2006.01); G03F 1/24 (2012.01); H01B 5/14 (2006.01); H01L 51/44 (2006.01); H01L 51/52 (2006.01); G03F 7/038 (2006.01); B82Y 20/00 (2011.01);
U.S. Cl.
CPC ...
G06F 3/041 (2013.01); B05D 3/007 (2013.01); B82Y 10/00 (2013.01); B82Y 40/00 (2013.01); G03F 1/24 (2013.01); G03F 7/0002 (2013.01); G03F 7/0047 (2013.01); G03F 7/161 (2013.01); G06F 3/044 (2013.01); H01B 1/22 (2013.01); H01B 5/14 (2013.01); H01B 13/0013 (2013.01); H05K 1/0271 (2013.01); H05K 1/0274 (2013.01); H05K 1/036 (2013.01); H05K 1/09 (2013.01); H05K 3/103 (2013.01); B82Y 20/00 (2013.01); G03F 7/038 (2013.01); G03F 7/0388 (2013.01); G06F 2203/04103 (2013.01); H01L 51/444 (2013.01); H01L 51/5203 (2013.01); H05K 2201/0108 (2013.01); H05K 2201/0137 (2013.01); H05K 2203/10 (2013.01); Y10T 428/24355 (2015.01); Y10T 442/188 (2015.04); Y10T 442/191 (2015.04);
Abstract

A method of fabricating a composite conductive film is provided. The method includes providing, as a matrix, a layer of cross-linkable polymer, where the cross-linkable polymer is in a non-cross-linked state. The method further includes introducing inorganic nanowires upon a surface of the layer of cross-linkable polymer. The inorganic nanowires are, in isolated form, characterized by a first conductivity stability temperature. The method further includes embedding at least some of the inorganic nanowires into the layer of cross-linkable polymer to form an inorganic mesh, thereby forming the composite conductive film. The method further includes cross-linking the polymer within a surface portion of the composite conductive film. Cross-linking the polymer within the surface portion of the composite conductive film results in the surface portion having a second conductivity stability temperature that is greater than the first conductivity stability temperature.

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