The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 19, 2019

Filed:

Apr. 02, 2015
Applicant:

Tactotek Oy, Oulunsalo, FI;

Inventors:

Kari Severinkangas, Oulu, FI;

Mikko Heikkinen, Oulu, FI;

Jarmo Saaski, Kempele, FI;

Assignee:

TACTOTEK OY, Oulunsalo, FI;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01D 7/08 (2006.01); G01L 3/00 (2006.01); G01L 1/14 (2006.01); H05K 3/10 (2006.01); A61B 5/103 (2006.01); A61B 5/11 (2006.01); A61B 5/00 (2006.01); H05K 1/18 (2006.01); H05K 3/28 (2006.01);
U.S. Cl.
CPC ...
G01L 1/146 (2013.01); A61B 5/1038 (2013.01); A61B 5/112 (2013.01); A61B 5/6807 (2013.01); H05K 1/189 (2013.01); H05K 3/10 (2013.01); H05K 3/284 (2013.01); H05K 2201/10037 (2013.01); H05K 2201/10098 (2013.01); H05K 2201/10151 (2013.01); H05K 2203/1305 (2013.01);
Abstract

A multilayer structure for a garment, optionally footwear, includes a flexible substrate film for accommodating electronics, a number of flexible sensor pads provided on the film utilizing printed electronics technology, optionally screen printing or ink jetting, at least one electronic circuit, preferably integrated circuit, further provided on the film for controlling capacitive measurements via the number of sensor pads for obtaining an indication of pressure subjected to the multilayer structure, a number of conductor traces further printed on the film for electrically connecting the at least one electronic circuit and the number of capacitive sensor pads, a power supply element for powering electricity-driven components including the at least one electronic circuit, and at least one plastic layer molded upon the film substantially embedding the number of sensor pads, conductor traces and the at least one electronic circuit therewithin. A related method of manufacture is presented.


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